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AMÉRIQUE DU NORD
IBR215L
ORDINATEURS MONOCARTES / EN STOCK

IBR215L

SBC Low-Power 2,5 po — NXP i.MX 8M Plus QuadLite - ARM Cortex-A53 Processor

SBC Low-Power 2,5 po — NXP i.MX 8M Plus QuadLite - ARM Cortex-A53 Processor. Soutien de garantie local et personnalisation d’ingénierie offerte sur demande.

PROCESSEUR
NXP Cortex®-A53 i.MX8M Plus QuadLite processor
MÉMOIRE
3GB DDR4 on board (option: 2/4/8GB)
AFFICHAGE
HDMI
ENVIRONNEMENT
With heat sink or through housing design: -40°C~85°C (-40°F ~185°F)Without heatsink:-40°C~65°C (-40°F ~149°F)
2.5 Disk Size SBCRISC based Single Board…
P/N # IBR215L
Introduction au chien de garde

Spécifications

17 LIGNES
Format2.5-inch SBC
ProcesseurNXP Cortex®-A53 i.MX8M Plus QuadLite processor
Mémoire système3GB DDR4 on board (option: 2/4/8GB)
Mémoire flash16GB eMMC on board (up to 256GB)
AffichageHDMI
Codec vidéoN/A
GraphiquesOpenGL Es 1.1, 2.0, 3.0,3.1OpenCL 3.0OpenVG 1.1OpenGL 4.0EGL 1.5Vulkan 1.1
E/S de bord1x On/Off button1x 12V~24V DC-in jack1x SD socket (UHS-I SDR-104, 104MB/s max.)1x Boot select switch (boot from eMMC or SD)1x HDMI 1.4a2x USB 3.0 Type-A2x RJ45 GbE LAN1x Mini-USB OTG
E/S internes1x M.2 B-Key(3052) with SIM socket (for 5G module)2x I2C / 4x GPIO1x Audio Line-in and Line-out1x12V~24V DC-in jack1x DC power (4-pin header)3x IO expansion 2mm pitch 2x20 headers with following features (Contact us for design reference):• 1x USB 2.0• 1x PCM• 2x UART(Rx, Tx)• 1x SDIO• 1x UART (Tx, Rx, CTS, RTS)• 2x USB 3.0• 1x 2ch LVDS with backlight control• 1x I2C• 2x PWM• 3x GPIO• 1x Cap touch IF• 2x MIPI-CSI for
E/S d’extension1x M.2 E-Key(2230)w/ SDIO, UART for wireless1x Mini PCI-E w/ USB 2.0, SIM, PCM for 4G/LTE1x DB-9 RS232/422/485 port2x USB 3.0 in 1x19-pin headers1x 2ch LVDS with backlight control1x Cap touch IF2x MIPI-CSI2x CAN-FD
Chien de garde256 levels, 0~128 seconds
DimensionsIBR215L: 105mm(W) x 72mm(D)4.13”(W) x 2.83”(D)IBR215-IO: 100mm(W) x 72mm3.94”(W) x 2.83”(D)IBR215L+IBR215-IO: 105mm(W) x 72mm(D) x 35mm(H)4.13”(W) x 2.83”(D) x 1.37”(H)
Entrée d’alimentation12V~24V DC-in jack
Température de fonctionnementWith heat sink or through housing design: -40°C~85°C (-40°F ~185°F)Without heatsink:-40°C~65°C (-40°F ~149°F)
Humidité relative10%~90% (non-condensing)
Systèmes d’exploitation pris en chargeYocto 5.0Android 11Other OS (by request)
CertificationCE/ FCC Class-B