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AMÉRIQUE DU NORD
ET980
MODULES EMBARQUÉS / EN STOCK

ET980

Module CPU COM Express Type 6 (R3.0) — 12th Gen Intel® Core™ i Mobile Processors

Module CPU COM Express Type 6 (R3.0) — 12th Gen Intel® Core™ i Mobile Processors. Soutien de garantie local et personnalisation d’ingénierie offerte sur demande.

PROCESSEUR
BGA1744 for 12th Gen Intel® Core™i7/i5/i3 processors
MÉMOIRE
2x DDR4-3200 SO-DIMM sockets, Max. 64GB, ECC compatible
STOCKAGE
N/A
AFFICHAGE
HDMI, DisplayPort, VGA, LVDS or eDP on carrier board
COM ExpressCPU Module

Spécifications

24 LIGNES
ProcesseurBGA1744 for 12th Gen Intel® Core™i7/i5/i3 processors
PCHN/A
Mémoire2x DDR4-3200 SO-DIMM sockets, Max. 64GB, ECC compatible
BIOSAMI
Minuterie de surveillance256 levels
Surveillance matérielleYes
Interface de stockageN/A
Emplacements d’extension1x PCI-E(x16), 1x PCI-E(x4), 4x PCI-E(x1) to carrier board
Contrôleur graphique12th Gen Intel® Core™ P-series processor integrated graphics
Sortie vidéoHDMI, DisplayPort, VGA, LVDS or eDP on carrier board
EthernetIntel® I226LM 2.5 GbERJ45 on carrier board
Chipset d’E/SFintek F81804U-I onboard
Port série2x COM ports (Tx/Rx only)
USB 2.08x USB2.0 via carrier board
USB 3.X4x USB 3.2 (10Gbps) via carrier board
Serial ATA2x SATA III via carrier board
AudioBuilt-in HD Audio controller
TPMTPM (2.0)
AutresPower: +12 V and +5 VSB for ATX, +12V for ATDigital I/O (4-in/4-out) , Watchdog Timer
Dimensions (L x l)125mm x 95mm (4.92“ x 3.74“)
Consommation électriqueIntel® Core™ i5-1250PE 1.50GHz w/ 2x 16GB DDR4-3200 +12V:2.6A
Température de fonctionnement0°C~60°C (32°F~140°F)
Température d’entreposage-20°C~80°C (-4°F~176°F)
Humidité relative90% (non-condensing @60)