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ET815 SPECIFICATIONS
CPU
Intel Mobile Pentium III / Celeron
CPU Front Side Bus
66/100/133MHz
Chipset
Intel 815E Chipset
GMCH: 82815 (544-pin BGA)
ICH2: 82801BA (360-pin BGA)
FWH: 82802AA(4Mb)
BIOS
Award 2Mbit Flash BIOS
System Memory
One SODIMM socket
Supports to 256MB* PC/100/133 SODIMM modules
* Certain 512MB DIMM modules are supported.
IDE Interface (on base board)
One enhanced IDE interface supports 2 IDE devices in UDMA/33/66/100, PIO mode 4 and bus master mode
LPC I/O
Winbond 83627 for IrDA interface, parallel port, COM ports, FDC, and hardware monitor
Parallel Port (on base board)
One parallel port supports SPP/EPP/ECP
Serial Ports (on base board)
Two RS-232 ports
| LOW POWER, HIGH PERFORMANCE, HIGH FLEXIBILITY & RELIABILITY
The ET815 is a CPU module based on the Intel 815E chipset. Measuring 100mm x 114mm, the module supports standard interfaces including USB, VGA, audio, Ethernet, IDE, serial ports, IrDA and parallel port. With its flexible plug on and compact Features:, ET815 can be implemented to support form factors including ATX, 5.25" Disk Size, and PICMG CPU Cards.
PCI to ISA Bridge
Winbond 83628 + 83629
ETX Interface
Four connectors for PCI-bus, USB, Audio, VGA, LCD, COM1, COM2, LPT, Floppy, IrDA, Mouse, Keyboard, IDE1, IDE2, Ethernet, ISA
Built-in VGA Function
SMI721G8, 8MB VGA memory
One channel 18-bit LVDS
Built-in Audio Function
ICH2 Built-in audio
With AC97 Codec STAC9721
Connectors for Line-out, Line-in, Microphone
Ethernet Function
Built in Intel 82801 with Intel 82562E PHY
Form Factor
ETX form factor
Dimensions
100mm x 114mm (3.98" x 4.49")
Power Requirement
+5V: 5A (for ET815-400, ET815-500)
+5V: 10A (Maximum)
Environmental Factors:
Operating Temperature
0°C~60°C (32°F~140°F)
Storage Temperature
-20°C~80°C (-4°F~176°F)
Relative Humidity
10%~90% (non-condensing)
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