IP300 SPECIFICATIONS

Form Factor
3.5" baseboard (For ETX CPU Modules)
Chipsets
Winbond 83877TF Super I/O
Intel 82559 LAN controller
Ti PCI1410 Cardbus controller
Battery
Lithium Battery for real time clock
LAN
RJ45 connector for LAN1
Pin Header for LAN2
USB
Pin header (4 port)
PCMCIA
Cardbus connector
Compact Flash
CF Card connector, support Type I

Keyboard, Mouse Connector
PS2 type connector (6-pin mini din)
Video output Connectors:
VGA Connector as DB15 slim-type connector
LVDS Panel Connector
Hirose DF13 Connector x 2
COM Ports Connector
DB9 slim-type connector for COM1
Pin Header for COM2,COM3,COM4
COM1,COM2 - RS232, RS422, RS485
COM3,COM4 - RS232
Floppy Connector
Pin Header
Parallel Port Connector
Pin Header
Digital I/O
Pin Header , Supports 4-In and 4-Out
Expansion Slot
PC/104
PCB Layer
4 Layers
Form factor:
Board Size 101mm x 146mm
Environmental Factors:
Operating Temperature:
0 C~60 C (32F~140F)
Storage Temperature:
-20C~80C (-68F~176F)
Relative Humidity:
10%~90% (non-condensing)

Ordering Information:

IP300 - 3.5" backplane for ETX CPU Module w/ 1 x Intel 82559 LAN, TI1410 CardBus, w/o cable kit(IB15)
IB15 Cable Kit - 2 x IDE, 2 x USB, COM, Printer, FDD, LAN, Audio, PS2, Power cable for IP300