IBT Technologies Inc.; 5405 Thimens; Quebec, Canada H4R 2H4; 1-866-590-4288; info@ibt.ca

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ARM-Based Wide Temperature SBC with NXP i.MX6 Cortex-A9 Dual Core 800MHz Automotive Grade CPU
Risc Platform

IB113
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FEATURE
  • NXP ARM Cortex-A9, i.MX6 Dual 800Mhz, automotive-grade processor
  • Supports -40°C~ 85°C environment, all industrial-grade components
  • Supports 12V~24V DC input voltage
  • 1GB DDR3, 4GB eMMC on board
  • Supports resistive touch panel (4/5-wires) and capacitive touch interface
  • Supports OpenGL ES 2.0 and OpenVG 1.1 hardware accelerators
  • Supports COM, CAN bus, USB-OTG, SD card, HDMI, dual channel LVDS
  • Supports rich I/O interface for BOM customization


IB113 SPECIFICATIONS

Form Factor 
3.5" Disk-Size SBC

CPU 
NXP Cortex™-A9 i.MX6 Dual 800MHz, automotive grade CPU

System Memory 
1GB DDR3 on board

Data Memory 
4GB eMMC on board
SD socket (up to 32GB)

Display 
HDMI
18/24 bit dual channel LVDS (up to 1920 x 1080)

Video Codec 
Decode: 1080p, 30fps

Encode 
1080p, 30fps

LAN 
1st LAN: 10/100/1000 Base-T Ethernet (Gb LAN)

2nd LAN 
10/100 Base-T Ethernet

Touch 
PM6000 resistive touch IC (4/5-wires) on board

USB 
I²C header on board (for capacitive touch)

Audio 
Audio pin header (1x microphone, 1x speaker)

RTC 
Seiko RTC IC on board

Watchdog 
256 Levels


Edge I/O 1x 1st 10/100/1000 LAN
1x 2nd 10/100 LAN
1x USB 2.0 Host (Type-A)
1x USB OTG (mini-USB Type-B)
1x COM RS-232/422/485
1x SD socket (up to 64GB)
1x DC-in jack
1x HDMI (Type-A)
1x Reset button

Headers and Expansion Slots 
Headers:
8x GPIO pin header
1x Debug port pin header
1x USB2.0 Host box header
1x I²C pin header
1x 4/5-wire resistive touch pin header
2x CAN Bus 2.0B (w/ isolation) pin headers
1x Dual channel LVDS box header (supports full HD)
1x Audio pin header (1x microphone, 1x speaker)
1x SATA header

Slots 
1x Full-size Mini PCI-E with USB interface

Power 
12V~24V DC-in

Dimensions 
102mm x 147mm (4” x 5.8”)

Devices 
WIFI/BT/3G+GPS moduel (option)

Software Support 
Ubuntu Linux 12.04(kernel 3.0.35)/ Android 4.3

Operating Temperature: -40°C~ 85°C (-40°F ~ 185°F)
Relative Humidity: 10%~90% (non-condensing)
Certification: CE/FCC Class A

IB113 I/O


Order Information
IB113 - 3.5-inch SBC w/ automotive-grade NXP i.MX6 dual core (800Mhz), 1GB DDR3, 2x LAN , SD, 1x COM ports, Mini PCI-E(x1) slot, HDMI, 8x GPIO, 2x CAN, 2nd LAN, 4GB eMMC, Resistive touch panel (4/5-wire) support
IB113A - 3.5-inch SBC w/ automotive-grade NXP i.MX6 solo core (800Mhz), 1GB DDR3, 1x LAN , SD, 1x COM ports, Mini PCI-E(x1) slot, LVDS, HDMI, 8x GPIO, 4GB eMMC

HSIB113-BGA-B - Heatsink for IB113
HSIB113-BGA-A - Heatsink for IB113A

Accessary (Optional) -
RF:
- 3G+GPS Combo (Mini PCIe card) -
- WIFI+BT Combo (Mini PCIe card) -
- WIFI module (USB I/F) -
- BT module (USB/IF) -
Display: - 800 x 600, resistive touch panel (5 wires)
LVDS cable: - LCD 341 -
Debug cable: - PK1-100A -

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