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ET815
SPECIFICATIONS
CPU
Intel
Mobile Pentium III / Celeron
CPU
Front Side Bus
66/100/133MHz
Chipset
Intel
815E Chipset
GMCH:
82815 (544-pin BGA)
ICH2:
82801BA (360-pin BGA)
FWH:
82802AA(4Mb)
BIOS
Award
2Mbit Flash BIOS
System
Memory
One
SODIMM socket
Supports
to 256MB* PC/100/133 SODIMM modules
* Certain 512MB DIMM modules are supported.
IDE
Interface (on base board)
One
enhanced IDE interface supports 2 IDE devices in UDMA/33/66/100,
PIO mode 4 and bus master mode
LPC
I/O
Winbond
83627 for IrDA interface, parallel port, COM ports, FDC, and hardware
monitor
Parallel
Port (on base board)
One
parallel port supports SPP/EPP/ECP
Serial
Ports (on base board)
Two
RS-232 ports
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LOW
POWER, HIGH PERFORMANCE, HIGH FLEXIBILITY & RELIABILITY
The ET815 is a CPU module based on the Intel 815E chipset. Measuring
100mm x 114mm, the module supports standard interfaces including
USB, VGA, audio, Ethernet, IDE, serial ports, IrDA and parallel
port. With its flexible plug on and compact Features:, ET815 can
be implemented to support form factors including ATX, 5.25" Disk
Size, and PICMG CPU Cards.
PCI
to ISA Bridge
Winbond
83628 + 83629
ETX
Interface
Four
connectors for PCI-bus, USB, Audio, VGA, LCD, COM1, COM2, LPT, Floppy,
IrDA, Mouse, Keyboard, IDE1, IDE2, Ethernet, ISA
Built-in
VGA Function
SMI721G8,
8MB VGA memory
One
channel 18-bit LVDS
Built-in
Audio Function
ICH2
Built-in audio
With
AC97 Codec STAC9721
Connectors
for Line-out, Line-in, Microphone
Ethernet
Function
Built
in Intel 82801 with Intel 82562E PHY
Form
Factor
ETX
form factor
Dimensions
100mm
x 114mm (3.98" x 4.49")
Power
Requirement
+5V:
5A (for ET815-400, ET815-500)
+5V:
10A (Maximum)
Environmental
Factors:
Operating
Temperature
0°C~60°C (32°F~140°F)
Storage
Temperature
-20°C~80°C (-4°F~176°F)
Relative
Humidity
10%~90%
(non-condensing)
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